Heat storage and release unit, chemical heat pump, and non-electrified cooling unit

ABSTRACT

A heat storage and release unit includes a reactant formed body for reacting with a reaction medium to store and release heat; a reaction vessel for accommodating the reactant formed body and exchanging heat with the reactant formed body; a reaction medium flow path structure, connected to the reaction vessel, for supplying the reaction medium to the reaction vessel or discharging the reaction medium from the reaction vessel. The reactant formed body includes a plate-like heat transfer plate that contacts the reaction vessel, heat transfer elements extending from a surface of the heat transfer plate at substantially right angles, and a reactant formed unit that encloses the heat transfer elements in such a way that the heat transfer elements are partially exposed from the reactant formed unit, and the reaction vessel can change form by a pressure difference between the outside and the inside of the reaction vessel.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat storage and release unit, achemical heat pump, and a non-electrified cooling unit.

2. Description of the Related Art

In recent years, a heat recovery system for recovering and using heatsources such as waste heat, such as a chemical heat pump and anadsorption refrigerator has drawn attention in terms of saving energy.In the heat recovery system, a heat storage and release unit including areactant that exchanges heat with a reaction medium, an evaporator thatevaporates the reaction medium, and a condenser that condenses thereaction medium are connected via an opening and closing mechanism.

In this kind of a heat recovery system, sufficient heat exchange may notbe performed between the reaction medium and the reactant if a contactarea between the reaction medium and the reactant in the heat storageand release unit is small. Therefore, conventionally, a technique isknown for increasing the contact area between the reaction medium andthe reactant as well as facilitating the movement of the reactionmedium, in which technique a porous material is sandwiched by a set ofthe reactants and the porous material is used as a flow path of thereaction medium.

Further, in the heat recovery system, sensible heat loss in a reactionvessel increases if capacity of the reaction vessel is big. Therefore,conventionally, a technique is known for reducing the sensible heat lossby reducing the capacity of the reaction vessel by using a reactionvessel formed by a sheet-like member.

However, in a heat storage and release unit that uses a porous materialfor a flow path of the reaction medium, when a sheet-like member is usedas a reaction vessel, the porous material may be compressed by apressure difference between the inside and the outside of the reactionvessel, and thus, a function as a flow path of the reaction medium maybe deteriorated. As a result, there is a case where sufficient heatexchange efficiency may not be achieved by a heat storage and releaseunit that includes a reaction vessel with a sheet-like member.

An object of an aspect of the present invention is to increase heatexchange efficiency in a heat storage and release unit which includes areaction vessel capable of changing form by a pressure differencebetween the outside and the inside of the reaction vessel.

CITATION LIST Patent Document [Patent Document 1] Japanese Laid-OpenPatent Application No. 2014-044000 [Patent Document 2] JapaneseLaid-Open Patent Application No. 9-142801 SUMMARY OF THE INVENTION

A heat storage and release unit is provided. The heat storage andrelease unit includes a reactant formed body configured to react with areaction medium to store and release heat; a reaction vessel configuredto accommodate the reactant formed body and exchange heat with thereactant formed body; a reaction medium flow path structure, connectedto the reaction vessel, configured to supply the reaction medium to thereaction vessel or discharge the reaction medium from the reactionvessel. The reactant formed body includes a plate-like heat transferplate that contacts the reaction vessel, heat transfer elementsextending from a surface of the heat transfer plate at substantially aright angle, and a reactant formed unit that encloses the heat transferelements in such a way that the heat transfer elements are partiallyexposed from the reactant formed unit, and the reaction vessel iscapable of changing form by a pressure difference between the outsideand the inside of the reaction vessel.

One aspect of the present invention increases heat exchange efficiencyin a heat storage and release unit which includes a reaction vesselcapable of changing form by a pressure difference between the outsideand the inside of the reaction vessel.

Other objects, features and advantages of the present invention willbecome more apparent from the following detailed description when readin conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are schematic diagrams of a reactant formed bodyaccording to an embodiment.

FIGS. 2A and 2B are schematic cross-sectional views of the reactantformed body according to an embodiment.

FIG. 3 is a schematic perspective view of a heat transfer plateaccording to an embodiment.

FIG. 4 is a schematic plan view of a heat transfer plate according to anembodiment (No. 1).

FIG. 5 is a schematic plan view of a heat transfer plate according to anembodiment (No. 2).

FIG. 6 is a schematic plan view of a heat transfer plate according to anembodiment (No. 3).

FIG. 7 is a schematic plan view of a heat transfer plate according to anembodiment (No. 4).

FIG. 8 is a schematic perspective view of a reactant formed bodyaccording to an embodiment.

FIGS. 9A through 9C are drawings illustrating an example-1 of a heatstorage and release unit according to an embodiment.

FIG. 10 is a schematic cross-sectional view of a heat storage andrelease unit according to a first embodiment.

FIG. 11 is a schematic cross-sectional view of a heat storage andrelease unit according to a second embodiment.

FIG. 12 is a schematic cross-sectional view of a heat storage andrelease unit according to a third embodiment.

FIG. 13 is a schematic cross-sectional view of a heat storage andrelease unit of a comparative example 1.

FIG. 14 is a schematic diagram of an example of a chemical heat pump.

FIG. 15 is a schematic diagram of an example of a non-electrifiedcooling unit.

FIGS. 16A and 16B are drawings illustrating an example-2 of a heatstorage and release unit according to an embodiment.

FIGS. 17A and 17B are drawings illustrating an example-3 of a heatstorage and release unit according to an embodiment.

FIGS. 18A through 18C are drawings illustrating a reactant formed bodyin the example-3 of a heat storage and release unit according to anembodiment.

FIGS. 19A and 19B are drawings illustrating a modified example of theexample-3 of a heat storage and release unit according to an embodiment.

FIG. 20 is a drawing illustrating a configuration of a reactant formedbody in the modified example of the example-3 of a heat storage andrelease unit according to an embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the following, embodiments of the present invention will be describedreferring to the accompanying drawings. It should be noted that in thespecification and the drawings, elements which include substantially thesame functional structure are given the same signs in order to avoidduplicated descriptions.

(Reaction Material Formed Body)

An example of a reactant formed body used in a heat storage and releaseunit according to an embodiment will be described. FIGS. 1A and 1B areschematic diagrams of a reactant formed body 10 according to anembodiment. FIGS. 2A and 2B are schematic cross-sectional views of thereactant formed body 10 according to an embodiment. A-A line in FIG. 1Aindicates a crosssection.

The reactant formed body 10 generates heat by reacting with a reactionmedium, or discharges the reaction medium by heating. As shown in FIGS.1A and 1B, the reactant formed body 10 includes a heat transfer plate11, heat transfer elements 12, and a reactant formed unit 13.

The heat transfer plate 11 is a plate-like member.

The heat transfer elements 12 are elements that extend from a surface ofthe heat transfer plate 11 at substantially right angles. The heattransfer elements 12 may have, for example, a pin-like shape or aplate-like shape. The heat transfer elements 12 include exposed areas 12a and exposed areas 12 b. The exposed areas 12 a are exposed from asurface of the reactant formed unit 13 on the side opposite from wherethe heat transfer plate 11 is disposed. The exposed areas 12 b areexposed from another surface of the reactant formed unit 13 on the sidewhere the heat transfer plate 11 is disposed.

FIG. 1A illustrates a reactant formed body 10A whose heat transferelements 12 include exposed areas 12 a that are exposed from a surfaceof the reactant formed unit 13 on the side opposite from where the heattransfer plate 11 is disposed. FIG. 2A illustrates a reactant formedbody 10B whose heat transfer elements 12 include exposed areas 12 b thatare exposed from a surface of the reactant formed unit 13 on the sidewhere the heat transfer plate 11 is disposed. FIG. 2B illustrates areactant formed body 10C whose heat transfer elements 12 include exposedareas 12 a that are exposed from a surface of the reactant formed unit13 on the side opposite from where the heat transfer plate 11 isdisposed, and exposed areas 12 b that are exposed from a surface of thereactant formed unit 13 on the side where the heat transfer plate 11 isdisposed.

It should be noted that the heat transfer plate 11 and the heat transferelements 12 will be described in detail later.

The reactant formed unit 13 encloses the heat transfer elements 12 insuch a way that the heat transfer elements 12 are partially exposed fromthe reactant formed unit 13. The reactant formed unit 13 is formed by,for example, molding and solidifying a reactant.

The reactant is not limited to a specific material as long as it canreversibly perform adsorption-desorption with the reaction medium andits form is solid or gel in the course of the adsorption-desorption.

As a reaction medium, for example, water, ammonium, or methanol can beused. In the case where water is used as a reaction medium, as areactant, for example, calcium sulfate, sodium sulfate, calciumchloride, magnesium chloride, manganese chloride, calcium oxide,magnesium oxide, sodium acetate, sodium carbonate, or calcium bromidecan be used. Further, adsorbent represented by silica gel or zeolite canbe also used.

In the case where ammonium is used as a reaction medium, as a reactant,for example, manganese chloride, magnesium chloride, nickel chloride,barium chloride, or calcium chloride can be used. In the case wheremethanol is used as a reaction medium, as a reactant, for example,magnesium chloride can be used. Further, one kind of the reactants alonemay be used, or a mixture of two or more kinds of the reactants may beused.

Further, the reactants include substance having deliquescence. Evensubstance having deliquescence can be used as long as it can take asolid form in the course of heat storage and release by applying animpregnation process by mixing it with expanded graphite.

It should be noted that a forming method of the reactant formed body 10is not limited but, for example, a method is preferable in which theheat transfer plate 11 integrated with the heat transfer elements 12 isset in a desired mold and a slurried reactant (semi-hydrate dissolved inwater) is poured and solidified. Further, for example, a method may beused in which the reactant formed body 10 is formed in a desired shapeby using a known binder. With the above methods, the reactant formedbody 10 can be easily formed, which improves productivity.

In the above-described reactant formed body 10, when the reactant formedbody 10 is accommodated in a reaction vessel 20 described below, theheat transfer elements 12 exposed from the reactant formed unit 13 serveas a bridging structure and form a flow path of the reaction medium(hereinafter, referred to as “reaction medium flow path 14”).

(Heat Transfer Plate)

Next, a heat transfer plate 11 according to an embodiment will bedescribed. FIG. 3 is a schematic perspective view of a heat transferplate 11 according to an embodiment. FIG. 4 is a schematic plan view ofa heat transfer plate 11 according to an embodiment. Specifically, FIG.3 illustrates a heat transfer plate 11 after heat transfer elements 12are folded, and FIG. 4 illustrates a heat transfer plate 11 before theheat transfer elements 12 are folded. It should be noted that it isassumed that X direction in FIG. 3 and FIG. 4 is a lateral direction,and Y direction is a longitudinal direction.

As shown in FIG. 3, the heat transfer plate 11 includes a plurality ofthe heat transfer elements 12 that are integrally formed with the heattransfer plate 11 and are folded at substantially a right angle withrespect to a surface of the heat transfer plate 11. Further, the heattransfer plate 11 includes through holes 111, penetrating the uppersurface and the lower surface of the heat transfer plate 11, which areformed by having the heat transfer elements 12 at least partially foldedat substantially right angles with respect to the upper surface of theheat transfer plate 11.

A material of the heat transfer plate 11 is not limited to a specificmaterial as long as it is a plate-like, easily processed material havinggood thermal conductivity. For example, metal materials includingaluminum and copper are preferable from the point of view that they canrealize a structure having good heat transfer between the metalmaterials and the reactant formed body.

It is preferable that the heat transfer elements 12 have a pin-likeshape. With the above arrangement, heat can be efficiently transferredamong the heat transfer plate 11, the heat transfer elements 12, and thereaction vessel 20.

Further, it is preferable that the heat transfer elements 12 be formedby having cut-out structures 112 formed in the heat transfer plate 11 asshown in FIG. 4 folded at substantially right angles with respect to theupper surface of the heat transfer plate 11 as shown in FIG. 3. As amethod for forming the cut-out structures 112, it is preferable to use asimple method such as a wire-cut method or a cutout-by-cutlery methodfrom the view point of mass production.

An angle of the heat transfer elements 12 with respect to the uppersurface of the heat transfer plate 11 is not limited as long as it issubstantially a right angle, but it is preferable that the angle beequal to or more than 70 degrees and equal to or less than 110 degreesfrom the view point of heat-transfer facilitation to a reactant at alocation away from the heat transfer plate 11. Further, it is preferablethat the angle be equal to or more than 80 degrees and equal to or lessthan 100 degrees from the view point of equidistribution ofheat-transfer facilitation effect to the reactant in the surface of theheat transfer plate 11.

Further, it is preferable that all of the heat transfer elements 12 facethe same direction with respect to the upper surface of the heattransfer plate 11. In the case where some of the heat transfer elements12 face a different direction with respect to the upper surface of theheat transfer plate 11, adjacent heat transfer elements may interferewith each other.

Size of the heat transfer elements 12 is not limited, but, for example,a width W of the heat transfer elements 12 may be 1 mm and a height Hmay be 5 mm. Further, arrangement of the heat transfer elements 12 isnot limited, but, for example, a pitch P1 in the lateral direction maybe 3.2 mm and a pitch P2 in the longitudinal direction may be 7.5 mm.

The through holes 111 are holes penetrating the upper surface and thelower surface of the heat transfer plate 11. The through holes 111 areformed when the cut-out structures 112 in the heat transfer plate 11 arefolded.

Further, for example, a reactant formed body 10A as shown in FIG. 8 canbe obtained by molding and solidifying the slurried calcium sulfatepoured onto the heat transfer plate 11 in such a way that the obtainedreactant formed body 10A encloses the heat transfer elements 12. Itshould be noted that it is preferable to prepare a mold material made ofresin, etc., beforehand in the above molding.

It should be noted that the arrangement of the heat transfer elements 12formed in the heat transfer plate 11 is not limited to theabove-described arrangement shown in FIG. 4 as long as the heat transferelements 12 are at substantially right angles with respect to the uppersurface of the heat transfer plate 11. However, it is preferable thatthe heat transfer elements 12 be evenly distributed in the surface ofthe heat transfer plate 11 from the view point of equidistribution ofheat-transfer facilitation effect in the surface of the heat transferplate 11.

Referring to FIG. 5 through FIG. 7, another example of the heat transferplate 11 will be described. FIG. 5 through FIG. 7 are schematic planviews of the heat transfer plate 11 according to an embodiment.

Another example of the heat transfer plate 11 may have a structure inwhich directions of adjacent cut-out structures 112 (folding directionto form heat transfer elements 12) is the same as shown in FIG. 5.Further, the heat transfer plate 11 may have a structure in whichcut-out structures 112 are continuously formed in the lateral directionas shown in FIG. 6.

Further, the heat transfer elements 12 may have a plate-like shape asshown in FIG. 7. The heat transfer plate 11 including plate-like heattransfer elements 12 may have a structure in which heat transferelements 12 with 20 mm width and 5 mm height are arranged with a 25 mmpitch P1 in the lateral direction and a 7.5 mm pitch in the longitudinaldirection.

Embodiments of the heat transfer plate 11 have been described above, butthe present invention is not limited to the above. For example, the heattransfer elements 12 extending at substantially right angles withrespect to the surface of the heat transfer plate 11 may be formed bywelding elements with a pin-like shape, a plate-like shape, apinholder-like shape, etc., to the heat transfer plate 11.

(Example-1 of Heat Storage and Release Unit)

Next, a heat storage and release unit according to an embodiment will bedescribed. FIGS. 9A through 9C are drawings illustrating an example-1 ofa heat storage and release unit 100 according to an embodiment.Specifically, FIG. 9A is a schematic side view of a heat storage andrelease unit 100 before a reactant formed body 10 is accommodated in areaction vessel 20. Further, FIG. 9B is a schematic plan view of theheat storage and release unit 100 after the reactant formed body 10 isaccommodated in the reaction vessel 20. Further, FIG. 9C is a schematicside view of the heat storage and release unit 100 after the reactantformed body 10 is accommodated in the reaction vessel 20.

The heat storage and release unit 100 according to an embodimentincludes the reactant formed body 10 and the reaction vessels 20 asshown in FIG. 9A. The heat storage and release unit 100 is formed by,for example, accommodating the reactant formed body 10 in the reactionvessel 20 and joining the reaction vessels 20 as shown in FIG. 9B andFIG. 9C.

The reaction vessel 20 is a container for accommodating the reactantformed body 10 and performing heat exchange with the reactant formedbody 10. Further, the reaction vessel 20 is a flexible container capableof changing form by a pressure difference between the outside and theinside of the reaction vessel 20.

The reaction vessel 20 includes a seal unit 21, a reactant accommodatingunit 22, and a reaction medium flow path structure 23.

The seal unit 21 is a part formed along the outer edge portion of thereaction vessel 20 (a part outside of a dashed line in FIG. 9B).

The reactant accommodating unit 22 is a part for accommodating thereactant formed body 10.

The reaction medium flow path structure 23 is formed in a part of theouter edge portion of the reaction vessel 20, and used for supplying areaction medium to be absorbed by the reactant formed body 10accommodated inside of the reaction vessel 20 or discharging thereaction medium desorbed from the reactant formed body 10.

The outer edge portion of the reaction vessel 20 is formed by the sealunit 21 or the reaction medium flow path structure 23. Therefore, thereaction medium in the reactant accommodating unit 22 is supplied ordischarged only through the reaction medium flow path structure 23.

As the reaction vessel 20, a sheet-like member having, for example, arectangle shape or a round shape may be used. As the sheet-like member,for example, a foil material (metal foil) using metal with goodheat-transfer performance such as aluminum, copper, etc., may be used.Film thickness of the metal foil is not limited, but, for example, inthe case where aluminum is used, it may be from 30 to 200 μm, and in thecase where copper is used, it may be from 10 to 100 μm. Further, aplastic sheet may also be used as the sheet-like member.

The joining method for the seal unit 21 of the reaction vessel 20 is notlimited, but, in the case where the reaction vessel 20 is made of metal,the method may be a joining method using diffusion bonding, etc., ajoining method using brazing, etc., or a joining method using a knownadhesive.

(Example-2 of Heat Storage and Release Unit)

Next, another example of a heat storage and release unit according to anembodiment will be described. FIGS. 16A and 16B are drawingsillustrating an example-2 of a heat storage and release unit 110according to an embodiment. Specifically, FIG. 16A is an exploded viewof the heat storage and release unit 110, and FIG. 16B is a schematicdiagram of the heat storage and release unit 110 after a reactant formedbody 10 is accommodated in a reaction vessel 20.

The heat storage and release unit 110 according to an embodimentincludes the reactant formed body 10, the reaction vessel 20, a reactionmedium flow path structure 23, and a lid 24 as shown in FIG. 16A. Theheat storage and release unit 110 is formed by, as indicated by arrowsin FIG. 16A, accommodating the reactant formed body 10 in the reactionvessel 20 and joining the reaction vessel 20 and the lid 24 at the sealunit 21.

The reaction vessel 20 has a bottom 20 b, and is formed in a box shapewith an opening in the top surface. The reaction vessel 20 is acontainer for accommodating the reactant formed body 10 and exchangingheat with the reactant formed body 10. Further, the reaction vessel 20is a flexible container capable of changing form by a pressuredifference between the outside and the inside of the reaction vessel 20.

The seal unit 21 is a part formed along the top side of the inner wallsurface of the reaction vessel 20 (an upper side part of a dashed linein FIG. 16A).

The reactant accommodating unit 22 is a part for accommodating thereactant formed body 10.

The reaction medium flow path structure 23 is formed to penetrate thelid 24, and used for supplying a reaction medium to the reactant formedbody 10 accommodated inside of the reaction vessel 20 or discharging thereaction medium desorbed from the reactant formed body 10. The reactionmedium flow path structure 23 is formed in, for example, a cylindricalshape with openings at both ends.

The lid 24 is a member for closing the opening in the top surface of thereaction vessel 20, and is formed in, for example, a plate-like shape.The lid 24 is joined to the reaction vessel 20 by having its sidesurface 24 s joined to the seal unit 21 of the reaction vessel 20. Asdescribed above, the opening in the top surface of the reaction vessel20 is closed by the lid 24. Therefore, the reaction medium in thereactant accommodating unit 22 is supplied or discharged only throughthe reaction medium flow path structure 23.

It should be noted that the reaction medium flow path structure 23 andthe lid 24 may be formed integrally, or may be formed separately andthen joined together.

The reaction vessel 20 may be formed by, for example, a drawing andironing molding method used for production of cans for beverages.Further, the reaction vessel 20 may be formed by using a sheet-likemember, by using various methods including laser welding, seam welding,adhesive bonding, etc. As a material of the reaction vessel 20,aluminum, copper, etc., may be used. In the case where aluminum is used,thickness of the reaction vessel 20 may be from 30 to 200 μm, and in thecase where copper is used, it may be from 10 to 100 μm. Further, aplastic sheet may be used as the sheet-like member.

The method for joining the reaction vessel 20 to the lid 24 at the sealunit 21 may be, in the case where the reaction vessel 20 is made ofmetal, a joining method using diffusion bonding, etc., a joining methodusing brazing, etc., or a joining method using a known adhesive.

Further, in the above example, the reaction vessel 20 has a squareshape, but may have a curved shape. It is important that the reactionvessel 20 has a flexible structure and is capable of changing form by apressure difference between the outside and the inside of the reactionvessel 20. The reaction vessel 20 is not limited to the examplesdescribed above, but may be any container as long as it has a flexiblefunction described above.

(Example-3 of Heat Storage and Release Unit)

Next, yet another example of a heat storage and release unit accordingto an embodiment will be described. FIGS. 17A and 17B are drawingsillustrating an example-3 of a heat storage and release unit 120according to an embodiment. Specifically, FIG. 17A is an exploded viewof the heat storage and release unit 120, and FIG. 17B is a schematicdiagram of the heat storage and release unit 120 after the reactantformed body is accommodated in the reaction vessel. FIGS. 18A through18C are drawings illustrating a reactant formed body 10E in theexample-3 of a heat storage and release unit 120 according to anembodiment.

The heat storage and release unit 120 according to an embodimentincludes a reactant formed body 10E, a reaction vessel 20, a reactionmedium flow path structure 23, and a lid 24 as shown in FIG. 17A. Theheat storage and release unit 120 is formed by, as indicated by arrowsin FIG. 17A, accommodating the reactant formed body 10E in the reactionvessel 20 and joining the reaction vessel 20 and the lid 24 at a sealunit 21.

As shown in FIG. 18C, the reactant formed body 10E (10) includes a heattransfer plate 11, heat transfer elements 12, and a reactant formed unit13.

The heat transfer plate 11 is a curved-plate-like member.

The heat transfer elements 12 are elements that extend at substantiallya right angle from a surface of the heat transfer plate 11. The heattransfer elements 12 may have, for example, a pin-like shape or aplate-like shape. The heat transfer elements 12 include exposed areas 12a that are exposed from a surface of the reactant formed unit 13, thesurface being on the side opposite from where the heat transfer plate 11is disposed. It should be noted that the heat transfer elements 12 maybe entirely enclosed by the reactant formed unit 13 and may not have theexposed areas 12 a.

The reactant formed unit 13 has a hollow cylindrical shape such that itcovers all of the inner wall surface of the heat transfer plate 11 andat least partially covers the heat transfer elements 12.

The reaction vessel 20 is a container that has a bottom 20 b as shown inFIG. 17A, has a cylindrical shape with an opening in the top surface,accommodates the reactant formed body 10, and exchanges heat with thereactant formed body 10. Further, the reaction vessel 20 has a flexiblestructure and is capable of changing form by a pressure differencebetween the outside and the inside of the reaction vessel 20.

The seal unit 21 is a part formed along the top side of the inner wallsurface of the reaction vessel 20 (an upper side part of a dashed linein FIG. 17A).

The reactant accommodating unit 22 is a part for accommodating thereactant formed body 10.

The reaction medium flow path structure 23 is formed to penetrate thelid 24, and used for supplying a reaction medium to the reactant formedbody 10 accommodated inside of the reaction vessel 20 or discharging thereaction medium desorbed from the reactant formed body 10. The reactionmedium flow path structure 23 is formed in, for example, a cylindricalshape with openings at both ends.

The lid 24 is a member for closing the opening in the top surface of thereaction vessel 20, and is formed in, for example, a plate-like shape.The lid 24 is joined to the reaction vessel 20 by having its sidesurface 24 s joined to the seal unit 21 of the reaction vessel 20. Asdescribed above, the opening in the top surface of the reaction vessel20 is closed by the lid 24. Therefore, the reaction medium in thereactant accommodating unit 22 is supplied or discharged only throughthe reaction medium flow path structure 23.

It should be noted that the reaction medium flow path structure 23 andthe lid 24 may be formed integrally, or may be formed separately andthen joined together.

The reaction vessel 20 may be formed by, for example, a drawing andironing molding method used for production of cans for beverages.Further, the reaction vessel 20 may be formed by using a sheet-likemember, by using various methods including laser welding, seam welding,adhesive bonding, etc. The reaction vessel 20 may be easily formed by,for example, bending a rectangular sheet-like member into a cylindricalshape and welding afterward, or, by using a thin-walled aluminum tubeand attaching a bottom plate to close one of the openings of thealuminum tube.

As a material of the reaction vessel 20, aluminum, copper, etc., may beused. In the case where aluminum is used, thickness of the reactionvessel 20 may be from 30 to 200 μm, and in the case where copper isused, it may be from 10 to 100 μm. Further, a plastic sheet may be usedas a material of the reaction vessel 20. The reaction vessel 20 is notlimited to a specific container as long as it has a flexible structureand is capable of changing form according to a pressure differencebetween the outside and the inside of the reaction vessel 20.

The method for joining the reaction vessel 20 to the lid 24 at the sealunit 21 may be, in the case where the reaction vessel 20 is made ofmetal, a joining method using diffusion bonding, etc., a joining methodusing brazing, etc., or a joining method using a known adhesive.

Modified Example of the Example-3 of the Heat Storage and Release Unit

Next, as a yet another example of a heat storage and release unitaccording to an embodiment, a modified example of example-3 of the heatstorage and release unit will be described.

FIGS. 19A and 19B are drawings illustrating a modified example ofexample-3 of a heat storage and release unit 130 according to anembodiment. Specifically, FIG. 19A is an exploded view of the heatstorage and release unit 130, and FIG. 19B is a schematic diagram of theheat storage and release unit 130 after a reactant formed body 10 isaccommodated in a reaction vessel 20. FIG. 20 is a drawing illustratingthe reactant formed body 10 in the modified example of example-3 of aheat storage and release unit 130 according to an embodiment, whichshows a cross-section of the reactant formed body 130.

The heat storage and release unit 130 is different from the heat storageand release unit 120 of example-3 in terms of the form of the reactantformed body 10. It should be noted that, because the heat storage andrelease unit 130 is the same as the heat storage and release unit 120 interms of other than the form of the reactant formed body 10, the aspectof the heat storage and release unit 130 different from the heat storageand release unit 120 will be mainly described below.

The heat storage and release unit 130 according to an embodimentincludes the reactant formed body 10, a reaction vessel 20, a reactionmedium flow path structure 23, and a lid 24 as shown in FIG. 19A. Theheat storage and release unit 130 is formed by, as indicated by arrowsin FIG. 19A, accommodating the reactant formed body 10 in the reactionvessel 20 and joining the reaction vessel 20 and the lid 24 at the sealunit 21.

As shown in FIG. 20, the reactant formed body 10 (10F) includes a heattransfer plate 11, heat transfer elements 12, and a reactant formed unit13.

The heat transfer plate 11 is a curved-plate-like member.

The heat transfer elements 12 are members which are joined to the innerwall surface of the heat transfer plate 11, a part of which members areextending at substantially a right angle with respect to a surface ofthe heat transfer plate 11, and all of which members are aligned to facesubstantially the same direction.

The reactant formed unit 13 is a member which has a hollow cylindricalshape and formed in such a way that it covers the entire inner wallsurface of the heat transfer plate 11 and the entirety of the heattransfer elements 12.

The reactant formed body 10 (10G) includes a heat transfer plate 11,heat transfer elements 12, and a reactant formed unit 13.

The heat transfer plate 11 is a curved-plate-like member.

The heat transfer elements 12 are members which are joined to the innerwall surface of the heat transfer plate 11, a part of which members areextending at substantially a right angle with respect to a surface ofthe heat transfer plate 11, and all of which members are aligned to facesubstantially the same direction. The heat transfer elements 12 includeexposed areas 12 a that are exposed from a surface of the reactantformed unit 13 on the side opposite from where the heat transfer plate11 is disposed.

The reactant formed unit 13 a member which has a hollow cylindricalshape and formed in such a way that it covers a part of inner wallsurface of the heat transfer plate 11 and a part of the heat transferelements 12.

The reactant formed body 10F and the reactant formed body 10G arecombined to form a cylindrical shape, and accommodated in the reactantaccommodating unit 22.

It should be noted that in the above example, the reactant formed body10G includes the heat transfer elements 12 including the exposed areas12 a that are exposed from a surface of the reactant formed unit 13 onthe side opposite from where the heat transfer plate 11 is disposed, butthe embodiment is not limited to this example as long as at least one ofthe reactant formed bodies 10 (reactant formed bodies 10F and 10G) hasheat transfer elements 12 which include the exposed areas 12 a that areexposed from a surface of the reactant formed unit 13 on the sideopposite from where the heat transfer plate 11 is disposed.

In the following, example-1 of the heat storage and release unit will bedescribed in detail.

First Embodiment

FIG. 10 is a schematic cross-sectional view of a heat storage andrelease unit 100A according to a first embodiment. FIG. 10 illustrates across section corresponding to B-B line in FIG. 9B.

In the heat storage and release unit 100A, as shown in FIG. 10, areaction vessel 20 accommodates the reactant formed body 10A with astructure shown in FIG. 1B and a reactant formed body 10D that has astructure in which exposed areas 12 a of the heat transfer elements 12of the reactant formed body 10A are removed. Specifically, the reactantformed body 10A and the reactant formed body 10D are facing each otherhaving respective heat transfer plates 11 facing outside, andaccommodated in the reaction vessel 20.

In the first embodiment, a space S1 is formed, between the reactantformed body 10A and the reactant formed body 10D, by the exposed areas12 a of the heat transfer elements 12 of the reactant formed body 10A,and the space S1 serves as a reaction medium flow path 14, which is afeature of the first embodiment.

In the process of forming the heat storage and release unit 100A, insideof the reaction vessel 20 is drawn to vacuum (evacuated) after thereactant formed body 10A and the reactant formed body 10D areaccommodated in the reaction vessel 20. At this time, the volume of thereaction vessel 20 is decreased and the reaction vessel 20 closelycontacts the heat transfer plate 11 of the reactant formed body 10A andthe heat transfer plate 11 of the reactant formed body 10D. Further, aspace of the outer edge portion of the reaction vessel 20 is alsocompressed and a so-called “vacuum pack” state is created.

Even in this state, in the heat storage and release unit 100A accordingto the first embodiment, the reaction medium flow path 14, whichcommunicates from the reaction medium flow path structure 23 to thesurface of the reactant formed unit 13, is maintained by the bridgingstructure of the heat transfer elements 12. Therefore, a sufficientcontact area between the reaction medium and the reactant can be securedas well as facilitating the movement of the reaction medium in thereaction vessel 20. As a result, heat exchange efficiency of the heatstorage and release unit 100A is improved.

It should be noted that, as shown in FIG. 10, the heat storage andrelease unit 100A includes the reactant formed body 10A having the heattransfer elements 12 with the exposed areas 12 a and the reactant formedbody 10D having the heat transfer elements 12 without the exposed areas12 a, but the present invention is not limited to this example. Forexample, both of the reactant formed bodies 10 may have the heattransfer elements 12 with the exposed areas 12 a exposed from thereactant formed unit 13, and the reactant formed bodies 10 may face eachother in such a way that the heat transfer elements 12 do not interferewith each other.

In this embodiment, the heat transfer plate 11 may be curved andaccommodated in the cylindrical reaction vessel 20 as shown in example-3of the heat storage and release unit 120. Further, directions of theheat transfer elements 12 may be arranged to fit the cylindricalreaction vessel 20 as shown in the modified example of example-3 of theheat storage and release unit 130.

Second Embodiment

FIG. 11 is a schematic cross-sectional view of a heat storage andrelease unit 100B according to a second embodiment. FIG. 11 illustratesa cross section corresponding to B-B line in FIG. 9B.

In the heat storage and release unit 100B, a reactant formed body 10Bwith a structure shown in FIG. 2A is accommodated in the reaction vessel20 as shown in FIG. 11.

In the second embodiment, a space S2 is formed, between the heattransfer plate 11 and the reactant formed unit 13, by the exposed areas12 b of the heat transfer elements 12 of the reactant formed body 10B,and the space S2 serves as a reaction medium flow path 14, which is afeature of the second embodiment.

In the process of forming the heat storage and release unit 100B, insideof the reaction vessel 20 is drawn to vacuum (evacuated) after thereactant formed body 10B is accommodated in the reaction vessel 20. Atthis time, the volume of the reaction vessel 20 is decreased and thereaction vessel 20 closely contacts the heat transfer plate 11 of thereactant formed body 10B and a surface of the reactant formed unit 13.Further, a space of the outer edge portion of the reaction vessel 20 isalso compressed and a so-called “vacuum pack” state is created.

Even in this state, in the heat storage and release unit 100B accordingto the second embodiment, the reaction medium flow path 14, whichcommunicates from the reaction medium flow path structure 23 to thesurface of the reactant formed unit 13, is maintained by the bridgingstructure of the heat transfer elements 12. Therefore, a sufficientcontact area between the reaction medium and the reactant can be securedas well as facilitating the movement of the reaction medium in thereaction vessel 20. As a result, heat exchange efficiency of the heatstorage and release unit 100B can be improved.

Third Embodiment

FIG. 12 is a schematic cross-sectional view of a heat storage andrelease unit 100C according to a third embodiment. FIG. 12 illustrates across section corresponding to B-B line in FIG. 9B.

In the heat storage and release unit 100C, a reactant formed body 10Bwith a structure shown in FIG. 2A and a reactant formed body 10C with astructure shown in FIG. 2B are accommodated in the reaction vessel 20 asshown in FIG. 12. Specifically, the reactant formed body 10B and thereactant formed body 10C are facing each other having respective heattransfer plates 11 facing outside, and accommodated in the reactionvessel 20.

In the third embodiment, a space S1 is formed, between the reactantformed body 10B and the reactant formed body 10C, by the exposed areas12 a of the heat transfer elements 12 of the reactant formed body 10C.Further, spaces S2 are formed, between the heat transfer plates 11 andthe reactant formed units 13, by the exposed areas 12 b of the heattransfer elements 12 of the reactant formed body 10B and the reactantformed body 10C, and the spaces S1 and S2 serve as reaction medium flowpaths 14, which is a feature of the third embodiment.

In the process of forming the heat storage and release unit 100C, insideof the reaction vessel 20 is drawn to vacuum (evacuated) after thereactant formed body 10B and the reactant formed body 10C areaccommodated in the reaction vessel 20. At this time, the volume of thereaction vessel 20 is decreased and the reaction vessel 20 closelycontacts the heat transfer plate 11 of the reactant formed body 10B andthe heat transfer plate 11 of the reactant formed body 10C. Further, aspace of the outer edge portion of the reaction vessel 20 is alsocompressed and a so-called “vacuum pack” state is created.

Even in this state, in the heat storage and release unit 100B accordingto the third embodiment, the three reaction medium flow paths 14, whichcommunicate from the reaction medium flow path structure 23 to thesurface of the reactant formed unit 13, are maintained by the bridgingstructure of the heat transfer elements 12. Therefore, a sufficientcontact area between the reaction medium and the reactant can be securedas well as facilitating the movement of the reaction medium in thereaction vessel 20. As a result, heat exchange efficiency of the heatstorage and release unit 100C can be improved.

It should be noted that, as shown in FIG. 12, the heat storage andrelease unit 100A includes the reactant formed body 10C having the heattransfer elements 12 with the exposed areas 12 a and the reactant formedbody 10B having the heat transfer elements 12 without the exposed areas12 a, but the present invention is not limited to this example. Forexample, both of the reactant formed bodies 10 may have the heattransfer elements 12 with the exposed areas 12 a exposed from thereactant formed unit 13, and the reactant formed bodies 10 may face eachother in such a way that the heat transfer elements 12 do not interferewith each other.

EXAMPLES

In the following, an embodiment of the present invention will bedescribed by using examples and comparative examples, which should notbe taken as limitations to the present invention.

Example 1

In Example 1, a heat storage and release unit with two reactant formedbodies 10A shown in FIG. 1 was created.

Specifically, two reactant formed bodies 10A were created by using theheat transfer plate 11 shown in FIG. 4, by folding the cut-outstructures 112 at substantially a right angle with respect to an uppersurface of the heat transfer plate 11, and forming the reactant formedunit 13 in such a way that the heat transfer elements 12 were enclosedin the reactant formed unit 13.

A 500 mm×800 mm×0.5 mm aluminum plate was used as the heat transferplate 11. The size of the cut-out structures 112 was adjusted in such away that the height of the heat transfer elements 12 was 10 mm, thewidth was 2 mm, and the density of the heat transfer elements 12 in thesurface was 78 elements (13×6 elements) per 100 cm².

Calcium sulfate was used as the reactant. The slurried calcium sulfatewas poured onto the heat transfer plate 11, and the reactant formed unit13 was formed enclosing the heat transfer elements 12. At this time, byadjusting the amount of the reactant, the heat transfer elements 12 wereexposed from the molded and solidified reactant formed unit 13 by 1 mm.At this time, the volume of the reactant formed unit 13 was about 3600cm³ per formed body.

The reactant formed bodies 10A were combined by having the surfaces ofthe reactant formed bodies 10A on the side where the heat transferelements 12 were exposed, facing each other, and by adjusting theirpositions in the surface direction so that the heat transfer elements 12of the reactant formed bodies 10A do not interfere each other; thereaction vessel 20 was formed by a 100 μm aluminum sheet-like member;and the reaction medium flow path structure 23 was attached. With theabove process, the heat storage and release unit 100A was created.

With the above process, the surface area of the reactant formed unit 13,capable of reacting with a reaction medium, was 8500 cm² per heatstorage and release unit 100A. The more the value of the surface areais, the faster is the reaction rate, and thus, the heat input/outputrate in the heat storage and release process can be improved.

Further, in Example 1, the thermal conductivity of the heat transferelements 12 in the longitudinal direction can be made about 2 W/(m*K),which is about 10 times 0.2 W/(m*K) as compared with the case where onlycalcium sulfate is solidified as a reactant. It should be noted that theheat conductivity can be adjusted by the number of the heat transferelements 12. It is needless to say that in the case where it is needed,the higher heat conductivity can be obtained by increasing the number ofthe heat transfer elements 12.

Example 2

In Example 2, a heat storage and release unit with one reactant formedbody 10B shown in FIG. 2A was created.

Specifically, the reactant formed body 10B was created by using the heattransfer plate 11 shown in FIG. 4, by folding the cut-out structures 112at substantially a right angle with respect to the upper surface of theheat transfer plate 11, and forming the reactant formed unit 13 in sucha way that the heat transfer elements 12 were enclosed in the reactantformed unit 13.

A 500 mm×800 mm×0.5 mm aluminum plate was used as the heat transferplate 11. The size of the cut-out structures 112 was adjusted in such away that the height of the heat transfer elements 12 was 20 mm, thewidth was 2 mm, and the density of the heat transfer elements 12 in thesurface was 52 elements (13×4 elements) per 100 cm².

Calcium sulfate was used as the reactant. The slurried calcium sulfatewas poured onto the heat transfer plate 11, and the reactant formed unit13 was formed enclosing the heat transfer elements 12. At this time, byadjusting the amount of the reactant, the length of the exposed areas 12b of the heat transfer elements 12 between the heat transfer plate 11and the reactant formed unit 13 was 2 mm. At this time, the volume ofthe reactant formed unit 13 was about 7200 cm³ per formed body.

The created reactant formed body 10B was accommodated in the reactionvessel 20 formed by a 100 μm aluminum metal-sheet-like member, thereaction medium flow path structure 23 was attached, and the heatstorage and release unit was created.

With the above process, the surface area of the reactant formed unit 13,capable of reacting with the reaction medium, was about 4500 cm² perheat storage and release unit. The more the value of the surface areais, the faster is the reaction rate, and thus, the heat input/outputrate in the heat storage and release process can be improved.

Further, in Example 2, the thermal conductivity of the heat transferelements 12 in the longitudinal direction can be made about 1.4 W/(m*K),which is about 7 times 0.2 W/(m*K) as compared with the case where onlycalcium sulfate is solidified as a reactant. It should be noted that theheat conductivity can be adjusted by the number of the heat transferelements 12. It is needless to say that in the case where it is needed,the higher heat conductivity can be obtained by increasing the number ofthe heat transfer elements 12.

Example 3

In Example 3, a heat storage and release unit with two reactant formedbodies 10C shown in FIG. 2B was created.

Specifically, the reactant formed bodies 10C were created by using theheat transfer plate 11 shown in FIG. 4, by folding the cut-outstructures 112 at substantially a right angle with respect to the uppersurface of the heat transfer plate 11, and forming the reactant formedunit 13 in such a way that the heat transfer elements 12 were enclosedin the reactant formed unit 13.

A 500 mm×800 mm×0.5 mm aluminum plate was used as the heat transferplate 11. The size of the cut-out structures 112 was adjusted in such away that the height of the heat transfer elements 12 was 10 mm, thewidth was 2 mm, and the density of the heat transfer elements 12 in thesurface was 78 elements (13×6 elements) per 100 cm².

Calcium sulfate was used as the reactant. The slurried calcium sulfatewas poured onto the heat transfer plate 11, and the reactant formed unit13 was formed enclosing the heat transfer elements 12. At this time, byadjusting the amount of the reactant, the heat transfer elements 12 wereexposed from the molded and solidified reactant formed unit 13 by 1 mm,and the length of the exposed areas 12 b of the heat transfer elements12 between the heat transfer plate 11 and the reactant formed unit 13was 1 mm.

The above structure can be realized, for example, by setting the heattransfer elements 12 in the prepared 50 cm×80 cm×1 cm silicon mold withthe heat transfer elements 12 dipped into the silicon mold by 1 mm; andadjusting the amount of poured reactant, in such a way that a gap isformed between the heat transfer plate 11 and the reactant formed unit13.

At this time, the volume of the reactant formed unit 13 was about 3200cm³ per formed body.

The reactant formed bodies 10C were combined by having the surfaces ofthe reactant formed bodies 10C on the side where the heat transferelements 12 were exposed, facing each other, and by adjusting theirpositions in the surface direction so that the heat transfer elements 12of the reactant formed bodies 10C do not interfere each other; thereaction vessel 20 was formed by a 100 μm aluminum sheet-like member;and the reaction medium flow path structure 23 was attached. With theabove process, the heat storage and release unit 100C was created.

With the above process, the surface area of the reactant formed unit 13,capable of reacting with the reaction medium, was about 16500 cm² perheat storage and release unit. The more the value of the surface areais, the faster is the reaction rate, and thus, the heat input/outputrate in the heat storage and release process can be improved.

Further, in Example 3, similar to Example 1, the thermal conductivity ofthe heat transfer elements 12 in the longitudinal direction can be madeabout 2 W/(m*K), which is about 10 times 0.2 W/(m*K) as compared withthe case where only calcium sulfate is solidified as a reactant. Itshould be noted that the heat conductivity can be adjusted by the numberof the heat transfer elements 12. It is needless to say that in the casewhere it is needed, the higher heat conductivity can be obtained byincreasing the number of the heat transfer elements 12.

Comparative Example 1

A comparative example 1 will be described. FIG. 13 is a schematiccross-sectional view of a heat storage and release unit of a comparativeexample 1.

In the comparative example 1, a heat storage and release unit 100Zhaving a reactant formed body 10Z without heat transfer elements 12 wascreated as shown in FIG. 13.

Specifically, the reactant formed body 10Z was created by, preparing a50 cm×80 cm×1 cm silicon mold, using calcium sulfate as a reactant, andpouring the slurried reactant into the silicon mold. The createdreactant formed body 10Z was accommodated in a reaction vessel 20 formedby a 100 μm aluminum metal-sheet-like member, a reaction medium flowpath structure 23 was attached, and the heat storage and release unit100Z was created.

With the above process, the surface area of the reactant formed unit 13,capable of reacting with the reaction medium, was about 500 cm² per heatstorage and release unit.

As described above, in Examples 1 through 3, compared with thecomparative example 1, the surface area of a reactant formed unit 13,capable of reacting with the reaction medium, was greatly increased, anda heat storage and release unit 100 capable of highly facilitating thereaction rate was realized. More specifically, in Examples 1 through 3,compared with the comparative example 1, from 9 to 32 times surfaceareas were obtained.

Further, the thermal conductivity in the reactant formed unit 13 wasgreatly increased by enclosing the heat transfer elements 12 in thereactant formed body 10. More specifically, in Examples 1 through 3,compared with the comparative example 1, from 7 to 10 times thermalconductivity was obtained.

In Examples 1 through 3, it is especially advantageous that the reactantmovement in the reaction vessel 20 can be facilitated, and the reactionsurface area can be increased by using a reaction vessel 20 with aflexible structure, and it is possible to design a heat storage andrelease unit 100 in which sensitive heat loss of the reaction vessel 20is especially decreased.

It should be noted that, in Examples 1 through 3, calcium sulfate wasused as a reactant, but the present invention is not limited to theseexamples. As a reactant, calcium oxide, magnesium oxide, calciumbromide, calcium chloride, a reactant that uses another chemicalreaction can be used, and various materials, capable of storing andreleasing heat, including adsorbent represented by silica gel andzeolite can be used.

Example 4

In Example 4, referring to FIG. 14, an example, in which the heatstorage and release unit 100 according to an embodiment is applied to achemical heat pump, will be described.

FIG. 14 is a schematic diagram of an example of a chemical heat pump200. It should be noted that in the case where the heat storage andrelease unit 100 is used as a chemical heat pump, one more heat storageand release units 100 should be prepared. A first heat storage andrelease unit 100 is connected to a condenser, and proceeds with a heatstorage process. Further, a second heat storage and release unit 100 isconnected to an evaporator, and proceeds with a heat release process. Itshould be noted that the chemical heat pump 200 has a feature in whichthe heat storage process and the heat release process can be switched byan opening and closing mechanism such as a valve, but the mechanism isindicated in a simplified way in FIG. 14.

The chemical heat pump 200 includes the heat storage and release unit100, a reaction medium flow path piping 210, a heat transfer medium flowpath 220, a condenser 230, and an evaporator 240.

The reaction medium flow path piping 210 is a piping an end of which isconnected to the reaction medium flow path structure 23 of the heatstorage and release unit 100. Further, another end of the reactionmedium flow path piping 210 is connected to the condenser 230 via avalve 250, and connected to the evaporator 240 via a valve 260.

The heat transfer medium flow path 220 is a flow path, inside of which aheat transfer medium flows through. Multiple heat storage and releaseunits 100 are arranged in the heat transfer medium flow path 220. Inthis case, the reaction medium flow path structures 23 of the heatstorage and release units 100 are thermally connected to each other viathe reaction medium flow path piping 210.

The condenser 230 is connected to the heat transfer medium flow path220, and has a function of condensing a gaseous reaction medium desorbedfrom the reactant formed unit 13 in the heat storage process.

The evaporator 240 has a function of evaporating the condensed reactionmedium in order to supply it to the reactant formed unit 13 in the heatrelease process.

Next, an example of heat recovery by using the chemical heat pump 200will be described. It should be noted that in this example, for the sakeof description convenience, a case will be described in which calciumsulfate is used for the reactant formed unit 13 and water vapor is usedas a reaction medium, but the present invention is not limited to thiscase.

In the heat storage process, the valve 260 is closed and the valve 250is opened. In this state, for example, exhaust generated at the factoryis introduced as a heat transfer medium H into the heat transfer mediumflow path 220; water vapor is desorbed from the hydrated calciumsulfate; and the heat release process progresses. The water vapordesorbed from the calcium sulfate goes through the reaction medium flowpath piping 210, and is condensed in the condenser 230.

On the other hand, in the heat release process, the valve 250 is closedand the valve 260 is opened. Water vapor evaporated in the evaporator240 is introduced into the heat storage and release units 100 throughthe reaction medium flow path piping 210. By having the introduced watervapor react with the calcium sulfate, the heat release processprogresses.

It is assumed that in the heat storing process and the heat releaseprocess, pressure in an area which is inside of the heat transfer mediumflow path 220 and outside of the heat storage and release units 100(i.e., an area in which the heat transfer medium H exists) is, forexample, an atmospheric pressure. On the other hand, because inside ofthe heat storage and release units 100 is in a state in which watervapor and the calcium sulfate exist in a vacuumed space, its pressure iswater vapor pressure in the heat storage and release units 100.

The above water vapor pressure will approximate water vapor pressure attemperature of the condenser 230 in the heat storage process, andapproximate water vapor pressure depending on the temperature of thecalcium sulfate, and both of the water vapor pressures are less than anormal atmospheric pressure. In other words, a pressure difference iscreated between the inside and the outside of the heat storage andrelease units 100, in which the pressure of the outside is higher thanthe pressure of the inside.

In this example, because a heat transfer surface, which is a part of theouter wall of the reaction vessel 20, is formed by a sheet-like member,the heat transfer surface is pressed against the calcium sulfate due tothe pressure difference. In other words, the heat transfer surface canbe connected to the reactant formed unit 13 with low thermal resistancebetween the heat transfer surface and the reactant formed unit 13. Withthe above arrangement, in the heat release process, the reaction heat,generated by reaction between the reactant formed unit 13 and thereaction medium, can be efficiently transferred to the heat transfersurface, and exchanged with the heat transfer medium H. On the otherhand, in the heat storage process, the heat transferred from the heattransfer medium H to the heat transfer surface can be efficiently storedin the reactant formed unit 13. In other words, a chemical heat pump 200with good thermal input output characteristics of the heat storage andrelease units 100 can be obtained.

In the above operation, compressive force due to the atmosphericpressure affects the inside of the reaction vessel 20, but the reactionmedium flow path 14 is maintained without being narrowed because of thebridging structure as described in Examples 1 through 3. Therefore, alarge contact area of the reactant formed unit 13 can be maintained aswell as the movement of the reaction medium in the heat storage andrelease process being facilitated.

An embodiment as a more specific example will be described in whichpressure of an area that is inside of the heat transfer medium flow path220 and outside of the heat storage and release unit is approximately anatmospheric pressure (e.g., 101 kPa), calcium sulfate is used as thereactant formed unit 13, and water vapor is used as the reaction medium.

A chemical heat pump 200 with good thermal input output characteristicsis obtained under a condition in which temperature of the calciumsulfate is less than 190° C., and water vapor pressure is less than 90kPa in the heat release process of the embodiment. However, the presentinvention is not limited to the above embodiment, but the highertemperature of the reactant formed unit 13 and the higher pressure ofthe reaction medium can be designed by using a method in which the heatstorage and release unit is arranged in a heat transfer medium bath andexternal pressure is applied, or the like. In other words, a chemicalheat pump 200 with good thermal input output characteristics can beobtained under all conditions in which the pressure in the heat storageand release unit is lower than the pressure of an area which is insideof the heat transfer medium flow path 220 and outside of the heatstorage and release unit.

Example 5

In Example 5, referring to FIG. 15, an aspect in which the heat storageand release unit 100 according to an embodiment is applied to anon-electrified cooling unit will be described.

FIG. 15 is a schematic diagram of an example of a non-electrifiedcooling unit 300. It should be noted that only a basic structure forrealizing a cooling function is shown in a simplified way in FIG. 15. Inthe cooling operation, it is assumed that the heat storage of thereactant in the heat storage and release unit has already beencompleted, and thus, the detailed description of heat storage will beomitted. For example, in the case where calcium sulfate is used as areactant, when firing is performed for 5 hours at 150° C., crystal wateris taken away; an anhydrous hydrate is obtained; and the heat is stored.This kind of operation should be performed beforehand.

The non-electrified cooling unit 300 includes the above-described heatstorage and release unit 100, a reaction medium flow path piping 310connected to the reaction medium flow path structure 23 of the heatstorage and release unit 100, and a cooling panel 320 (corresponding tothe evaporator 240 of the chemical heat pump 200). The reaction mediumflow path piping 310 is connected to the cooling panel 320 via a valve330. The cooling panel 320 is arranged, for example, in a cooling room340 and cools the inside of the cooling room 340.

Next, the cooling operation in which the non-electrified cooling unit300 is used will be described. In this example, for the sake ofdescription convenience, a case will be described in which calciumsulfate is used for the reactant formed unit 13 and water vapor is usedas a reaction medium, but the present invention is not limited to thiscase.

The heat storage and release unit 100 is in a state where the heatstorage is completed, and the cooling panel 320 is filled with water.Inside of the heat storage and release unit 100, the reaction mediumflow path piping 310, and the cooling panel 320 is vacuumed and thevalve 330 is closed.

In the above state, when the valve 330 is opened, the water in thecooling panel 320 is evaporated and introduced into the heat storage andrelease unit 100 through the reaction medium flow path piping 310. Byhaving the introduced water vapor react with the calcium sulfate,evaporation of the water in the cooling panel 320 is facilitated, and,as a result, the cooling panel 320 is cooled by the heat ofvaporization.

The calcium sulfate generates heat by reacting with the water vapor, butthe generated heat is efficiently released into the atmosphere fromsurfaces of the reaction vessel 20, and the reaction between the calciumsulfate and the water vapor is continuously performed because of thefacilitation effect of heat transfer and reaction of the heat storageand release unit 100 of this example. The above cooling effect continuesuntil either the calcium sulfate in the heat storage and release unit100 becomes a hemihydrate and the reaction stops, or the water in thecooling panel 320 is evaporated.

In other words, a non-electrified cooling unit 300 with good coolingcapacity can be provided. As described above, because power supply isnot needed in the cooling operation, the function in this example isreferred to as a non-electrified cooling unit 300.

As described above, a chemical heat pump and a non-electrified coolingunit have been described by using examples, but the present invention isnot limited to the above examples and various modifications andvariations can be made within the scope of the present invention.

The present invention is not limited to the specifically disclosedembodiments, and variations and modifications may be made withoutdeparting from the scope of the present invention.

The present application is based on and claims the benefit of priorityof Japanese Priority Application No. 2015-068476 filed on Mar. 30, 2015,and Japanese Priority Application No. 2015-199692 filed on Oct. 7, 2015,the entire contents of which are hereby incorporated herein byreference.

What is claimed is:
 1. A heat storage and release unit comprising: areactant formed body configured to react with a reaction medium to storeand release heat; a reaction vessel configured to accommodate thereactant formed body and exchange heat with the reactant formed body; areaction medium flow path structure, connected to the reaction vessel,configured to supply the reaction medium to the reaction vessel ordischarge the reaction medium from the reaction vessel, wherein thereactant formed body includes a plate-like heat transfer plate thatcontacts the reaction vessel, heat transfer elements extending from asurface of the heat transfer plate at substantially right angles, and areactant formed unit that encloses the heat transfer elements in such away that the heat transfer elements are partially exposed, and whereinthe reaction vessel is capable of changing form by a pressure differencebetween the outside and the inside of the reaction vessel.
 2. The heatstorage and release unit according to claim 1, wherein the reactionvessel is formed by a sheet-like member.
 3. The heat storage and releaseunit according to claim 2, wherein the sheet-like member is a metal foilor a plastic sheet.
 4. The heat storage and release unit according toclaim 1, wherein the heat transfer elements have a pin-like shape or aplate-like shape.
 5. The heat storage and release unit according toclaim 1, wherein the reactant formed unit is formed by molding andsolidifying a reactant.
 6. The heat storage and release unit accordingto claim 1, wherein the heat transfer elements include exposed areasthat are exposed from a first surface of the reactant formed unit, thefirst surface being on the side opposite from where the heat transferplate is disposed.
 7. The heat storage and release unit according toclaim 1, wherein the heat transfer elements include exposed areas thatare exposed from a second surface of the reactant formed unit, thesecond surface being on the side where the heat transfer plate isdisposed.
 8. The heat storage and release unit according to claim 1,wherein the heat transfer elements are integrally formed with the heattransfer plate and formed by having parts of the heat transfer platefolded at substantially right angles with respect to the surface of theheat transfer plate.
 9. The heat storage and release unit according toclaim 1, wherein the heat transfer plate and the heat transfer elementsinclude aluminum or copper.
 10. A chemical heat pump comprising: theheat storage and release unit according to claim 1; a heat transfermedium configured to be thermally connected to the reaction vessel; areaction medium flow path piping configured to be connected to thereaction medium flow path structure in the reaction vessel; a condenserconfigured to be connected to the reaction medium flow path piping viaan opening and closing mechanism; and an evaporator configured to beconnected to the reaction medium flow path piping via the opening andclosing mechanism.
 11. A non-electrified cooling unit comprising: theheat storage and release unit according to claim 1; a reaction mediumflow path piping configured to be connected to the reaction medium flowpath structure of the heat storage and release unit; and a cooling panelconfigured to be connected to the reaction medium flow path piping viaan opening and closing mechanism.